Design Guidelines

Here you will find what we recommend as a good designing practice in connection with our standard capabilities.

EXTERNAL LAYERS AND INTERNAL SIGNAL LAYERS

We recommend that you keep in mind our minimum requirements.  Here they are:
 

TRACK TO BOARD EDGE DESIGN GUIDELINES

Track to edge clearance on all layers is a must for several reasons:

1) This will prevent partial or complete removal of tracks. Partial removal will result in exposed copper on the edge of the board causing possible shorting in contact with metal case or guide, possible shorting of inner layer ground and power plane from resulting burrs. It will also lead to copper oxidization over time especially in corrosive or humid environments.

2) If tracks are fully covered with solder mask, it will improve the adhesion of the mask on the edge of the board. Our minimum track to edge clearance requirement is 0.3mm. This requirement equally applies to tracks and planes on outer and inner layers. If possible a larger clearance is preferable especially on inner layer planes.

Note!
For scored (V-grooved) jobs a larger clearance is required in order to allow for the angle of the blade. On 1.6mm thick boards, using a standard blade, an extra 0.15mm is needed.

HOLE TO PAD DESIGN GUIDELINES

All pads and  annular rings should be maximised wherever possible. Our preferred minimum hole-to-pad requirement is 6.0 mil.