|
ANNULAR RING |
|
Copper pad
surrounding the hole. The minimum annular ring refers to the
difference between the diameter of the hole and the diameter of the
pad. |
|
BASE COPPER |
|
The copper
thickness on the supplied material before manufacturing. |
|
CAD |
|
Computer
aided design |
|
CAM |
|
Computer
aided manufacturing |
|
COMPONENT HOLES |
|
Holes used for
insertion of component leads and soldered for electrical connections |
|
DRILLING ASPECT
RATIO |
|
The ration
between the minimum drill size used and the PCB thickness. |
|
HASL |
|
Hot Air Solder Level - Levelling the freshly applied molten tin- lead
finish after the application of the soldermask. |
|
INNERLAYER HOLE CLEARANCE |
|
A clearance in
the copper of an internal plane layer, which is larger than the hole
itself. |
|
IPC |
|
Institute for
Interconnecting and Packaging Electronic Circuits |
|
ISO |
|
International
Standards Organisation |
|
MIL |
|
1/1000 part
of an inch. 4 thou = 0.1 mm |
|
PCB |
|
Printed Circuit Board - also called printed wiring boards (PWB),
circuit boards, flex and flex rigid boards. It’s a general term for
a PCB of any number of layers. |
|
SMT |
|
Surface Mount Technology. Non leaded component (SMD –surface mount
components) used in PCB designs. |
|
THPLATED |
|
Through Hole
Plated - Holes plated inside in order to connect two surfaces. |
|
VIA HOLE |
|
Plated holes
not used as component holes but only serves as interlayer
connections. |
|
V-SCORE =
V-GROOVED |
|
V-shaped
groove scored on both sides of the board for an easy separation
after assembly. |
